Updated news

The second announcement is available here along with the list of invited speakers. The call for abstracts is now opened ! (October 2016)

We invite sponsors to support the REI-19 international conference ! Download the sponsorship information here

The first announcement is available here (April 2016) along with an advertising poster


Welcome !

 REI in 2017 will be the 19th international conference dedicated to research relating to radiation effects in insulators and non-metallic materials. In 2017, discover REI in Versailles, a city which was shaped by French History and in particular under the period of King Louis XIV, at only 20 km from Paris. 

Since its first edition held in 1981 in Arco, Italy, REI has been the international forum held every two years to present and discuss the latest achievements in the field of insulating materials modification through different kinds of radiation source (ions, electrons, neutrons...). The REI conference is one of the most prominent and long running conference series in the field of radiation effects in materials.

REI-19 is organized by several laboratories all members of the new Université Paris-Saclay: (i) the CSNSM, a joint research unit of Université Paris-Sud and CNRS (IN2P3), (ii) the SRMP (DEN/DMN), SCCME and INSTN at CEA Saclay,  and (iii) the LSI lab, a joint research unit of CEA(DRF/IRAMIS)-CNRS-Polytechnic School. We greatly acknowledge the support of our sponsors. REI-19 is organized in cooperation with the International Atomic Energy Agency.

We look forward to meeting in 2017 in Versailles, France !

 Gaël Sattonnay, Chair, on behalf of the organizing committee.





Important dates

October 2016
Call for abstracts
15th January 2017
Abstract submission deadline
1st March 2017
Notification of abstract acceptance
March 2017
Online registration starts
30th June - 1st July
International School
2nd July 2017
Welcome reception
3rd - 7thJuly 2017
Conference starts
3rd July 2017
Manuscript submission deadline
November 2017
Full proceedings submitted to Elsevier

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